{"title":"Surface Micromachined CMOS-MEMS Pirani Vacuum Gauge With Stacked Temperature Sensor","authors":"Xiangyu Song;Lifeng Huang;Yuanjing Lin;Linze Hong;Wei Xu","doi":"10.1109/JMEMS.2024.3367380","DOIUrl":null,"url":null,"abstract":"In this paper, we present a surface micromachined Pirani vacuum gauge integrated with a stacked temperature sensor using CMOS-MEMS technology. The proposed Pirani gauge features a \n<inline-formula> <tex-math>$2.23~\\mu \\text{m}$ </tex-math></inline-formula>\n thick suspended microheater, which is positioned between two designed heat sinks. The upper and lower gap spacing between the heat sink and the microheater is \n<inline-formula> <tex-math>$0.53~\\mu \\text{m}$ </tex-math></inline-formula>\n, which is made by the surface etching of two metal films. Additionally, a temperature sensor based on a poly-Si resistor is directly integrated into the lower heat sink. The temperature sensor shows a sensitivity of 45 ohm/°C over a linear range of 10~60 °C, while its measurement error is less than 0.11 °C in the worst case. The Pirani gauge achieves a high sensitivity of 0.96 V/Dec under fine vacuum conditions, and its heating power is less than 8.3 mW in the vacuum range of 0.8~14000 Pa. Moreover, the measured output of the Pirani gauge closely matches the proposed semi-empirical model, while the noise measurements indicate that the sensor has a resolution as low as \n<inline-formula> <tex-math>$6.4\\times 10 ^{\\mathbf {-3}}$ </tex-math></inline-formula>\n Pa in very fine vacuum conditions. This integrated Pirani gauge and temperature sensor system, in combination with its high performance, makes it a promising sensing node for vacuum and temperature monitoring in semiconductor equipment. [2023-0184]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 2","pages":"274-281"},"PeriodicalIF":2.5000,"publicationDate":"2024-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10452801","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10452801/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, we present a surface micromachined Pirani vacuum gauge integrated with a stacked temperature sensor using CMOS-MEMS technology. The proposed Pirani gauge features a
$2.23~\mu \text{m}$
thick suspended microheater, which is positioned between two designed heat sinks. The upper and lower gap spacing between the heat sink and the microheater is
$0.53~\mu \text{m}$
, which is made by the surface etching of two metal films. Additionally, a temperature sensor based on a poly-Si resistor is directly integrated into the lower heat sink. The temperature sensor shows a sensitivity of 45 ohm/°C over a linear range of 10~60 °C, while its measurement error is less than 0.11 °C in the worst case. The Pirani gauge achieves a high sensitivity of 0.96 V/Dec under fine vacuum conditions, and its heating power is less than 8.3 mW in the vacuum range of 0.8~14000 Pa. Moreover, the measured output of the Pirani gauge closely matches the proposed semi-empirical model, while the noise measurements indicate that the sensor has a resolution as low as
$6.4\times 10 ^{\mathbf {-3}}$
Pa in very fine vacuum conditions. This integrated Pirani gauge and temperature sensor system, in combination with its high performance, makes it a promising sensing node for vacuum and temperature monitoring in semiconductor equipment. [2023-0184]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.