Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance†

Abstract

The mechanical and high-temperature resistance properties of epoxy resins cured at low temperatures (T_curing ≤ 100 °C) are often inferior, and the most toughening modification methods for epoxy resins tend to compromise thermal resistance, which significantly limit the practical applications of it. Therefore, this work reported a low viscosity and low-temperature curing epoxy hybrid resin system (OPEP), adopting E-51 as a resin matrix, liquid anhydride (MHHPA) as a curing agent, tertiary amine (DMBA) as a curing accelerator, and reactive octa-epoxy terminated polyhedral oligomeric silsesquioxane (OG-POSS) as a toughening modifier. Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing. The OG-POSS exhibits superior compatibility and reactivity with the resin matrix, and its addition slightly reduces the E_α of the curing reaction and has a certain promotive effect on the curing of epoxy resin. In addition, the curing reaction rate of the OPEP resin complies with the Šesták–Berggren autocatalytic kinetics model. The impact strength, flexural strength, tensile strength, and elongation at break of the OPEP resin reached a maximum of 15.55 kJ m⁻², 121.65 MPa, 90.36 MPa, and 2.48%, representing increases of 55.97%, 3.1%, 64.68%, and 26.51% compared to those of the pure resin, respectively. Notably, due to the heat-resistant inorganic silicon cage structure of OG-POSS, the thermal decomposition temperature (T_d5), glass transition temperature (T_g), and heat distortion temperature (T_HDT) of the OPEP_0.02 resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic–inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.