Hengbo Zhu;Yun Cao;Wanli Ma;Xiaoyu Kong;Shenghong Lei;Haining Lu;Weirong Nie;Zhanwen Xi
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引用次数: 0
Abstract
Dynamic modeling is the basis for predicting the behavior of the electro-thermal actuator (ETA). Although the sequential decoupling method, often used in previous studies, has been able to model the dynamics of ETAs, most of them focused only on the ETAs themselves, and few considered the effects of end effectors. In this work, a dynamic multi-fields coupling model considering the effects of end effectors was developed. Due to the end effector, the dynamic model changes from a one-way coupled problem to a complex two-way coupled problem, limiting the commonly used sequential decoupling method. In order to solve the two-way coupled problem, a thermal microscope system was first employed to study the heat transfer characteristics between the ETA and the end effector at different thicknesses of the air gap. Subsequently, a combination of the Crank-Nicolson finite difference method and finite element method was employed to solve the problem numerically. It was eventually demonstrated by experiments that the presented dynamic model is an effective analytical technique to predict the dynamic behavior of the ETA with end effectors.
动态建模是预测电热致动器(ETA)行为的基础。虽然以往研究中经常使用的顺序解耦方法已经能够建立 ETA 的动态模型,但大多数研究只关注 ETA 本身,很少考虑终端效应器的影响。在这项工作中,我们建立了一个考虑到终端效应器影响的动态多场耦合模型。由于末端效应器的存在,动态模型从单向耦合问题变为复杂的双向耦合问题,从而限制了常用的顺序解耦方法。为了解决双向耦合问题,首先采用了热显微镜系统来研究不同气隙厚度下 ETA 和末端效应器之间的传热特性。随后,结合使用 Crank-Nicolson 有限差分法和有限元法对问题进行数值求解。实验最终证明,所提出的动态模型是预测带有末端效应器的 ETA 动态行为的有效分析技术。
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.