{"title":"Comparison of the Microstructural Characteristics and the Electrothermal Fracture Mechanism of Au-Pd-Coated Copper Wire and Cu-Ti Micro-alloyed Wire","authors":"Yi-Tze Chang, Fei-Yi Hung, Bo Wu","doi":"10.1007/s11664-024-10944-x","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":506265,"journal":{"name":"Journal of Electronic Materials","volume":"47 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s11664-024-10944-x","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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