Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch

Abstract

Wafer-to-wafer hybrid bonding is an attractive 3D integration technology for stacking multiple heterogeneous chips with high 3D interconnect density. We highlight recent design and technology innovations that enable hybrid Cu, SiCN-to-Cu and SiCN bonding with interconnect pitches down to an unprecedented 400 nm.