A ScAlN-based piezoelectric breathing mode dual-ring resonator with high temperature stability

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhaoyang Lu , Longlong Li , Wen Chen , Yuhao Xiao , Weilong You , Guoqiang Wu
{"title":"A ScAlN-based piezoelectric breathing mode dual-ring resonator with high temperature stability","authors":"Zhaoyang Lu ,&nbsp;Longlong Li ,&nbsp;Wen Chen ,&nbsp;Yuhao Xiao ,&nbsp;Weilong You ,&nbsp;Guoqiang Wu","doi":"10.1016/j.mee.2024.112144","DOIUrl":null,"url":null,"abstract":"<div><p>In this work, a scandium-doped aluminum nitride (ScAlN)-based piezoelectric breathing mode dual-ring resonator with high temperature stability is presented. The designed resonator consists of two identical rings and a coupling straight beam in between. A combination of highly doped silicon and composite structure using silicon oxide is implemented to improve the frequency-temperature stability of the resonator. The dual-ring resonator is fabricated based on a ScAlN-based thin-film piezoelectric-on‑silicon (TPoS) platform. The measurement results show that the fabricated dual-ring resonator has a loaded quality factor (<span><math><msub><mi>Q</mi><mi>l</mi></msub></math></span>) of 6889 and an insertion loss of 13.898 dB at its resonant frequency of 16.766 MHz, corresponding to a motional resistance of 395 <span><math><mi>Ω</mi></math></span>, and an unloaded quality factor (<span><math><msub><mi>Q</mi><mi>un</mi></msub></math></span>) of 8681. The resonator's <span><math><msub><mi>Q</mi><mi>un</mi></msub></math></span> is almost constant within the pressure range of less than 300 Pa, indicating a good process tolerance in the vacuum packaging process. With the aid of the passive temperature compensation, the reported resonator exhibits an overall frequency variation of less than ±70 ppm over the entire temperature range of 20 °C to 105 °C, which agrees well with the predicted value obtained by finite element method (FEM) analysis. Moreover, Allan deviations of the resonator-based oscillator frequency are collected.</p></div>","PeriodicalId":18557,"journal":{"name":"Microelectronic Engineering","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167931724000133","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

In this work, a scandium-doped aluminum nitride (ScAlN)-based piezoelectric breathing mode dual-ring resonator with high temperature stability is presented. The designed resonator consists of two identical rings and a coupling straight beam in between. A combination of highly doped silicon and composite structure using silicon oxide is implemented to improve the frequency-temperature stability of the resonator. The dual-ring resonator is fabricated based on a ScAlN-based thin-film piezoelectric-on‑silicon (TPoS) platform. The measurement results show that the fabricated dual-ring resonator has a loaded quality factor (Ql) of 6889 and an insertion loss of 13.898 dB at its resonant frequency of 16.766 MHz, corresponding to a motional resistance of 395 Ω, and an unloaded quality factor (Qun) of 8681. The resonator's Qun is almost constant within the pressure range of less than 300 Pa, indicating a good process tolerance in the vacuum packaging process. With the aid of the passive temperature compensation, the reported resonator exhibits an overall frequency variation of less than ±70 ppm over the entire temperature range of 20 °C to 105 °C, which agrees well with the predicted value obtained by finite element method (FEM) analysis. Moreover, Allan deviations of the resonator-based oscillator frequency are collected.

Abstract Image

Abstract Image

具有高温稳定性的 ScAlN 基压电呼吸模式双环谐振器
本文介绍了一种基于掺钪氮化铝(ScAlN)的具有高温稳定性的压电呼吸模式双环谐振器。所设计的谐振器由两个相同的环和中间的耦合直梁组成。为提高谐振器的频率-温度稳定性,采用了高掺杂硅和使用氧化硅的复合结构。双环谐振器是基于硅基 ScAlN 薄膜压电(TPoS)平台制造的。测量结果表明,所制造的双环谐振器在其谐振频率 16.766 MHz 时的加载品质因数(Ql)为 6889,插入损耗为 13.898 dB,对应的运动电阻为 395 Ω,非加载品质因数(Qun)为 8681。谐振器的 Qun 在小于 300 Pa 的压力范围内几乎保持不变,这表明在真空包装过程中具有良好的工艺容差。在被动温度补偿的帮助下,报告的谐振器在 20 °C 至 105 °C 的整个温度范围内显示出小于 ±70 ppm 的整体频率变化,这与通过有限元法(FEM)分析获得的预测值十分吻合。此外,还收集了基于谐振器的振荡器频率的阿兰偏差。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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