Microstructure Evolution and First-Order Reversal Curve Analysis of the Interphase Coupling in SmCo Thick Film

IF 1.1 4区物理与天体物理 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Magnetics Letters Pub Date : 2023-12-18 DOI:10.1109/LMAG.2023.3344026

Oksana Koplak;Federico Maspero;Alejandro Plaza;Andrea Del Giacco;Maria Cocconcelli;Riccardo Bertacco

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Abstract

Thick SmCo films of 500 nm thickness were deposited by radio frequency sputtering in W/SmCo/W structures on a Si substrate. After annealing at 650–750 °C, the as-grown soft amorphous structure transforms into a mixture of crystalline Sm ₂ Co ₁₇ and SmCo ₅ hard magnetic phases. Annealing at 650 °C leads to film crystallization with an average grain size of 64 nm, coercivity of 0.5 T, and remanence magnetization of about 0.5 T for a maximum applied field of 2 T. The remanence magnetization decreases by 20% upon annealing at 750 °C, whereas the average crystalline size and coercivity increase up to 73 nm and 1.1 T, respectively. Series of the first-order reversal curves recorded in the samples that were annealed at 650 °C and 750 °C demonstrate redistribution of the switching fields between the softer (Sm ₂ Co ₁₇₎ and harder (SmCo ₅ ) phases, depending on the strength of interphase interaction. Overall, the higher remanence and sizable coercivity of films annealed at 650 °C make them good candidates for the fabrication of micromagnets to be integrated in microelectromechanical systems.

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钐钴厚膜中相间耦合的微观结构演变和一阶反转曲线分析

通过射频溅射法在硅衬底上沉积了 W/SmCo/W 结构的 500 nm 厚钐钴薄膜。在 650-750 °C 退火后，生长的软质无定形结构转变为结晶 Sm2Co17 和 SmCo5 硬磁相的混合物。在 650 °C 退火后，薄膜结晶，平均晶粒大小为 64 nm，矫顽力为 0.5 T，在最大外加磁场为 2 T 时，剩磁约为 0.5 T；在 750 °C 退火后，剩磁降低了 20%，而平均晶粒大小和矫顽力则分别增加到 73 nm 和 1.1 T。在 650 ℃ 和 750 ℃ 下退火的样品记录的一阶反转曲线系列表明，开关场在较软（Sm2Co17）和较硬（SmCo5）相之间重新分布，这取决于相间相互作用的强度。总之，在 650 ℃ 下退火的薄膜具有较高的剩磁和相当大的矫顽力，是制造集成到微机电系统中的微型磁体的理想材料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Magnetics Letters PHYSICS, APPLIED-

CiteScore

2.40

自引率

0.00%

发文量

期刊介绍： IEEE Magnetics Letters is a peer-reviewed, archival journal covering the physics and engineering of magnetism, magnetic materials, applied magnetics, design and application of magnetic devices, bio-magnetics, magneto-electronics, and spin electronics. IEEE Magnetics Letters publishes short, scholarly articles of substantial current interest. IEEE Magnetics Letters is a hybrid Open Access (OA) journal. For a fee, authors have the option making their articles freely available to all, including non-subscribers. OA articles are identified as Open Access.