Thermal Energy Storage Heat Exchanger Design: Overcoming Low Thermal Conductivity Limitations of Phase-Change Materials

Melissa Messenger, R. M. Manglik, S. Boetcher
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Abstract

Recently, there has been a renewed interest in solid-to-liquid phase-change materials (PCMs) for thermal energy storage (TES) solutions in response to ambitious decarbonization goals. While PCMs have very high thermal storage capacities, their typically low thermal conductivities impose limitations on energy charging and discharging rates. Extensive research efforts have focused on improving PCM thermal conductivity through the incorporation of additives. However, this approach presents challenges such as achieving uniform mixtures, maintaining high latent heat, and cost. Alternatively, it has been demonstrated that, in this study, reducing the length scale of the PCM-encasement thickness can eliminate the low thermal conductivity effect of PCMs. To illustrate this concept, a one-dimensional PCM slab was numerically simulated. The thickness of the slab was varied to represent dimensions found in flow passages of compact heat exchangers, and the heat transfer coefficient of the heating fluid was varied to represent lower and upper bounds while also including nominal values encountered in air-to-air heat exchangers. The thermal conductivity was parametrically varied from the natural value of the PCM to simulated enhanced values (potentially achieved through additives) of up to 400 times larger. Results show that reducing the PCM encasement thickness yields substantially better performance than by improving the thermal conductivity, thereby demonstrating the potential for compact heat exchanger design to overcome the PCM thermal conductivity limitations.
热能存储热交换器设计:克服相变材料热传导率低的限制
最近,人们对用于热能储存(TES)解决方案的固液相变材料(PCMs)重新产生了兴趣,以响应雄心勃勃的去碳化目标。虽然 PCM 具有很高的热存储容量,但其通常较低的热传导率对能量充放电速率造成了限制。大量的研究工作集中在通过添加添加剂来提高 PCM 的热传导率。然而,这种方法面临着各种挑战,如实现均匀混合物、保持高潜热和成本等。另外,本研究还证明,减小 PCM-封装厚度的长度尺度可以消除 PCM 的低导热效应。为了说明这一概念,我们对一维 PCM 板进行了数值模拟。板的厚度根据紧凑型热交换器流道中的尺寸而变化,加热流体的传热系数根据下限和上限而变化,同时也包括空气到空气热交换器中的额定值。导热系数的参数变化范围从 PCM 的自然值到模拟增强值(可能通过添加剂实现),最多可增加 400 倍。结果表明,减少 PCM 封装厚度所产生的性能比提高热导率要好得多,从而证明了紧凑型热交换器设计在克服 PCM 热导率限制方面的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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