A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry

IF 2 3区工程技术 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Experimental Mechanics Pub Date : 2024-01-24 DOI:10.1007/s11340-023-01026-w

X. Sun, S. Wang, W. Xing, X. Cheng, L. Li, C. Li, Z. Wang

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Abstract

Background

Stress measurement for thin films is crucial in a variety of fields such as in semiconductor manufacturing, the optoelectronics industry, and biomedical science, among others. However, most measurement methods require surface treatment of the thin film.

Objective

A label-free measurement method for plane stress states in optical isotropic thin films based on spectroscopic ellipsometry analysis is proposed and verified in this paper.

Methods

The proposed method is based on the modulation of the stress-optic effect on reflected spectroscopic ellipsometry. A theoretical model is established to describe the relation between all components of the plane-stress state and the classic ellipsometric parameters (Ψ, Δ). An algorithm is developed to determine all components of a plane-stress state by fitting the model to the experiment data.

Results

In the verification experiment, we determined the plane stress state of a Cu film coated on a PI (polyimide) substrate. The results show a reasonable agreement between the experimental measurements from spectroscopic ellipsometry and the theoretical analysis based on the applied loading.

Conclusion

The results prove that our method can effectively measure the plane stress state of optical isotropic thin films.

Abstract Image

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利用光谱椭偏仪测量光学各向同性薄膜平面应力状态的无标签测量方法

背景薄膜应力测量在半导体制造、光电子工业和生物医学等多个领域都至关重要。本文提出并验证了一种基于光谱椭偏仪分析的光学各向同性薄膜平面应力状态无标记测量方法。方法本文提出的方法基于反射光谱椭偏仪的应力光学效应调制。建立了一个理论模型来描述平面应力状态的所有分量与经典椭偏参数（Ψ、Δ）之间的关系。结果在验证实验中，我们确定了涂覆在 PI（聚酰亚胺）基底上的铜膜的平面应力状态。结果表明，光谱椭偏仪的实验测量结果与基于外加载荷的理论分析结果之间存在合理的一致性。

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来源期刊

Experimental Mechanics 物理-材料科学：表征与测试

CiteScore

4.40

自引率

16.70%

发文量

111

审稿时长

3 months

期刊介绍： Experimental Mechanics is the official journal of the Society for Experimental Mechanics that publishes papers in all areas of experimentation including its theoretical and computational analysis. The journal covers research in design and implementation of novel or improved experiments to characterize materials, structures and systems. Articles extending the frontiers of experimental mechanics at large and small scales are particularly welcome. Coverage extends from research in solid and fluids mechanics to fields at the intersection of disciplines including physics, chemistry and biology. Development of new devices and technologies for metrology applications in a wide range of industrial sectors (e.g., manufacturing, high-performance materials, aerospace, information technology, medicine, energy and environmental technologies) is also covered.