Effect of Process Parameters in Additively Manufactured Sensors prepared via Material Extrusion Processes: Correlation among Electrical, Mechanical and Microstructure Properties
Gianni Stano, Neshat Sayah, Douglas E. Smith, Trevor J. Fleck
{"title":"Effect of Process Parameters in Additively Manufactured Sensors prepared via Material Extrusion Processes: Correlation among Electrical, Mechanical and Microstructure Properties","authors":"Gianni Stano, Neshat Sayah, Douglas E. Smith, Trevor J. Fleck","doi":"10.1016/j.addlet.2024.100194","DOIUrl":null,"url":null,"abstract":"<div><p>Fusion-based Material Extrusion (MEX) Additive Manufacturing (AM) processes have been extensively used for the fabrication of smart structures with embedded sensors, proving to have several benefits such as reduction in cost, manufacturing time, and assembly. A major issue negatively affecting 3D printed sensors is related to their poor electrical conductivity, as well as inconsistent electrical performance, which leads to electrical power losses amongst other issues. In the present paper, a set of process parameters (ironing, printing temperature, and infill overlap) has been analyzed by performing a Design of Experiment (DoE) factorial plan to minimize the electrical resistance. The best process parameters configuration involves a remarkable reduction of electrical resistance of 47.9%, as well as an improvement of mechanical properties of 31.9% (ultimate tensile strength), 25.8% (elongation at break) and 28.14% (flexural stress). The microstructure of the obtained results has also been analyzed by employing a high-resolution, X-ray Computed Tomography (X-Ray CT) system showing a reduction of intralayer voids of 19.5%. This work demonstrates a clear correlation between process parameters and the corresponding electrical properties, mechanical properties, and internal microstructure. In the present research, it has been shown that i) it is possible to significantly improve the overall 3D printed sensors performance by process parameter selection, and ii) small changes in the microstructure lead to remarkable improvements in electrical and mechanical performance.</p></div>","PeriodicalId":72068,"journal":{"name":"Additive manufacturing letters","volume":null,"pages":null},"PeriodicalIF":4.2000,"publicationDate":"2024-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772369024000033/pdfft?md5=aae1a3e8c589701551c2416dfc5dec38&pid=1-s2.0-S2772369024000033-main.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing letters","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2772369024000033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Fusion-based Material Extrusion (MEX) Additive Manufacturing (AM) processes have been extensively used for the fabrication of smart structures with embedded sensors, proving to have several benefits such as reduction in cost, manufacturing time, and assembly. A major issue negatively affecting 3D printed sensors is related to their poor electrical conductivity, as well as inconsistent electrical performance, which leads to electrical power losses amongst other issues. In the present paper, a set of process parameters (ironing, printing temperature, and infill overlap) has been analyzed by performing a Design of Experiment (DoE) factorial plan to minimize the electrical resistance. The best process parameters configuration involves a remarkable reduction of electrical resistance of 47.9%, as well as an improvement of mechanical properties of 31.9% (ultimate tensile strength), 25.8% (elongation at break) and 28.14% (flexural stress). The microstructure of the obtained results has also been analyzed by employing a high-resolution, X-ray Computed Tomography (X-Ray CT) system showing a reduction of intralayer voids of 19.5%. This work demonstrates a clear correlation between process parameters and the corresponding electrical properties, mechanical properties, and internal microstructure. In the present research, it has been shown that i) it is possible to significantly improve the overall 3D printed sensors performance by process parameter selection, and ii) small changes in the microstructure lead to remarkable improvements in electrical and mechanical performance.
基于熔融技术的材料挤压(MEX)快速成型制造(AM)工艺已被广泛用于制造带有嵌入式传感器的智能结构,并被证明具有降低成本、缩短制造时间和装配等多种优势。对 3D 打印传感器产生负面影响的一个主要问题是其导电性能差,以及电气性能不稳定,从而导致电能损耗等问题。本文通过执行 "试验设计"(DoE)因子计划,分析了一组工艺参数(熨烫、打印温度和填充重叠),以最大限度地降低电阻。最佳工艺参数配置使电阻显著降低了 47.9%,机械性能提高了 31.9%(极限拉伸强度)、25.8%(断裂伸长率)和 28.14%(弯曲应力)。此外,还采用高分辨率 X 射线计算机断层扫描(X-Ray CT)系统分析了所得结果的微观结构,结果显示层内空隙减少了 19.5%。这项工作表明,工艺参数与相应的电气性能、机械性能和内部微观结构之间存在明显的相关性。本研究表明:i)通过工艺参数选择,可以显著提高 3D 打印传感器的整体性能;ii)微观结构的微小变化就能显著提高电气和机械性能。