Wet Film Leveling for Promoting the Uniformity and Conductivity of Silver Nanowire Transparent Electrode

Abstract

Wet film leveling can greatly promote film uniformity. However, in the field of metal nanowire, wet film leveling is rarely mentioned. For low-viscosity inks like metal nanowire ink, how to realize wet film leveling is still unclear. Herein, we study the wet film leveling of silver nanowire ink and systematically investigate the relationship between leveling effect and influence factors: (1) there is a uniformity-promotion limit for traditional methods, while wet film leveling can break through this limit and further promote the film uniformity; (2) for wet film leveling, lowering ink’s surface tension has no effect, and eliminating surface tension gradient by high-surface-tension leveling agent is the main task; (3) leveling process includes wet film destruction process and ink reflow process; (4) in the destruction process, the leveling-agent solubility and quantity dominate the leveling effect, while the influence of surface tension is little; (5) for solubility and quantity, there is a suitable range to realize optimum leveling effect, and the leveling effect exhibits a contrary relationship with the solubility in a suitable range (2–11%); (6) in the reflow process, the main influence factor is ink viscosity, and the leveling effect exhibits a contrary relationship with ink viscosity. After being leveled by 1.5% n-pentanol, the sheet resistance and sheet-resistance variation coefficient of film decrease from 38.3 Ω/sq/3.83% to 25.7 Ω/sq/1.88%. Further study reveals that the film improvement is not from the ink wettability and drying. Above theoretical results possess certain universality for film preparation by a wet process and can be used by the science and industry field.