Design, fabrication and measurement of metal-semiconductor field effect transistor based on zinc oxide material

Hla Myo Tun, Rizky Ema Wulansari, Devasis Pradhan, Z. Naing
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Abstract

The paper mainly focuses on the design, fabrication and measurement on Zinc Oxide (ZnO)-based Metal-Semiconductor Field Effect Transistor. The research problem in this study is difficulty on observing the electronic properties of ZnO materials to fabricate the high performance transistor design with non-toxic semiconductor materials. Even though the wide band gap materials of Group III and V possess high performance properties for fabricating the power electronics devices, the harmful impacts could not be reduced. The research solution for the problem statement in this study is emphasized on the non-toxic materials of Group II and VI-based high performance power electronics devices fabrication. The experimental studies of the device fabrication were conducted by Pulse Laser Deposition (PLD) process in standard laboratory. The step-by-step procedures for MSFET device fabrication were discussed and the confirmation of developed device fabrication was completed. The approaches on all measurement were completed based on band diagram condition, quantum interference on metal-semiconductor materials, and current-voltage characteristics. The step by step measurement for fabricated device for the proposed structure could be confirmed by standard measurement techniques. The proposed design has been validated for the utilization of high performance applications. The physical properties and physical characteristics for measurement results were confirmed by the theoretical analyses. The numerical analyses have been completed with the help of MATLAB. All results have been proved by recent research works.
基于氧化锌材料的金属半导体场效应晶体管的设计、制造和测量
本文主要关注基于氧化锌(ZnO)的金属半导体场效应晶体管的设计、制造和测量。本研究的难点在于观察氧化锌材料的电子特性,从而利用无毒半导体材料制作出高性能的晶体管设计。尽管 III 族和 V 族宽带隙材料具有制造电力电子器件的高性能,但其有害影响却无法减少。本研究针对上述问题,重点研究了基于第二类和第六类无毒材料的高性能电力电子器件制造方案。器件制造的实验研究是在标准实验室中采用脉冲激光沉积(PLD)工艺进行的。讨论了 MSFET 器件制造的步骤,并完成了对已开发器件制造的确认。所有测量方法都是根据带图条件、金属半导体材料的量子干扰和电流电压特性完成的。通过标准测量技术,对所提出结构的器件制造进行了逐步测量和确认。所提出的设计已在高性能应用中得到验证。理论分析证实了测量结果的物理特性和物理特征。数值分析是在 MATLAB 的帮助下完成的。所有结果均已得到近期研究成果的证实。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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