Ziwei Yuan, Meng Xie, Jianlei Qian, Wenjie Fan, Menglu Li, Liao Guo, Yan Sun, Wenxin Fu
{"title":"Low-temperature-curable and photo-patternable benzocyclobutene-derived aggregation-induced emission-active polymer dielectrics","authors":"Ziwei Yuan, Meng Xie, Jianlei Qian, Wenjie Fan, Menglu Li, Liao Guo, Yan Sun, Wenxin Fu","doi":"10.1002/agt2.487","DOIUrl":null,"url":null,"abstract":"<p>The high curing temperatures required for traditional benzocyclobutene (BCB) materials have posed limitations on their applicability in high-temperature-sensitive fields. To address this challenge, our work focuses on the synthesis of a novel tetraphenylethylene (TPE)-functionalized BCB monomer, TPE–BCB, achieved through the introduction of an ether bond onto the BCB's four-membered ring via Williamson reaction. TPE–BCB demonstrates remarkable low-temperature curing properties, characterized by a ring-opening peak temperature of 190°C, representing a reduction of 60°C compared to conventional BCBs. Fully cured TPE–BCB resins exhibit exceptional dielectric and mechanical properties, coupled with minimal water absorption. Additionally, the incorporation of TPE with aggregation-induced emission characteristics enhances the resins’ luminescence and photolithographic capabilities. Notably, our TPE–BCB resins achieve impressive photolithography performance with a resolution ratio of up to 10 μm. In contrast to conventional BCB-functionalized resins, TPE–BCB offers the dual advantage of low-temperature curing and luminescence. This development marks a significant step in the advancement of low-temperature curing BCB materials and serves as a pioneering example in the realm of multilayer wafer bonding materials.</p>","PeriodicalId":72127,"journal":{"name":"Aggregate (Hoboken, N.J.)","volume":null,"pages":null},"PeriodicalIF":13.9000,"publicationDate":"2024-01-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/agt2.487","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Aggregate (Hoboken, N.J.)","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/agt2.487","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The high curing temperatures required for traditional benzocyclobutene (BCB) materials have posed limitations on their applicability in high-temperature-sensitive fields. To address this challenge, our work focuses on the synthesis of a novel tetraphenylethylene (TPE)-functionalized BCB monomer, TPE–BCB, achieved through the introduction of an ether bond onto the BCB's four-membered ring via Williamson reaction. TPE–BCB demonstrates remarkable low-temperature curing properties, characterized by a ring-opening peak temperature of 190°C, representing a reduction of 60°C compared to conventional BCBs. Fully cured TPE–BCB resins exhibit exceptional dielectric and mechanical properties, coupled with minimal water absorption. Additionally, the incorporation of TPE with aggregation-induced emission characteristics enhances the resins’ luminescence and photolithographic capabilities. Notably, our TPE–BCB resins achieve impressive photolithography performance with a resolution ratio of up to 10 μm. In contrast to conventional BCB-functionalized resins, TPE–BCB offers the dual advantage of low-temperature curing and luminescence. This development marks a significant step in the advancement of low-temperature curing BCB materials and serves as a pioneering example in the realm of multilayer wafer bonding materials.