MUF resin incorporating SiO2 and TiO2 nanoparticles: characterization and performance as a plywood adhesive

IF 2.4 3区 农林科学 Q1 FORESTRY
Zhenyu Wei, Xiangnan Kong, Bin Jia, Shitao Xia, Shuguang Han
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引用次数: 0

Abstract

To overcome the defects of longer curing times and higher curing temperatures for melamine urea formaldehyde resins (MUF) used in wood panel products, nanofluid MUF resin adhesives were prepared by dispersing SiO2 and TiO2 nanoparticles into the MUF resin at six concentration levels based on the overall mass of the adhesive, 0%, 0.2%, 0.4%, 0.6%, 0.8% and 1%, with the assistance of ultrasound. The excellent thermal conductivities of the nanofluid adhesives eliminated the defects of the MUF resins. When the SiO2 and TiO2 nanoparticles were incorporated, the viscosity increased as the nanoparticle concentration increased, the maximum viscosity increased by 13.4% with SiO2 nanoparticles (1.0% level) and 11.4% with TiO2 nanoparticles (1.0% level), the pot life, curing time, and free formaldehyde content of the MUF resins declined to varying degrees as the nanoparticle loading level was increased, the pot life maximum decreased by 38.5% with SiO2 nanoparticles (0.2% level) and 36.0% with TiO2 nanoparticles (0.2% level), the maximum reduction in curing time was 13.3% with SiO2 nanoparticles (0.4% level) and 13.6% with TiO2 nanoparticles (0.6% level), and the maximum content of free formaldehyde was reduced by 32.3% with SiO2 nanoparticles (1.0% level) and 41.9% with TiO2 nanoparticles (1.0% level). The nanofluid MUF resins showed much higher bonding strengths and lower formaldehyde emissions than pure MUF resins after being treated with the same hot pressing method used during plywood manufacturing. The maximum bonding strength was increased by 28.8% with the SiO2 nanoparticles (1.0% level) and 25.4% with the TiO2 nanoparticles (1.0% level) at a hot-pressing temperature of 100 °C and a hot-pressing time of 60 s/mm. The maximum formaldehyde emissions were reduced by 46.3% with the SiO2 nanoparticles (1.0% level) and 46.3% with the TiO2 nanoparticles (1.0% level) at a hot-pressing temperature of 110 °C and a hot-pressing time of 40 s/mm. Furthermore, nanofluid MUF resins used in plywood manufacturing decreased the hot-pressing temperature or shortened the hot-pressing time required.

Abstract Image

含有二氧化硅和二氧化钛纳米颗粒的 MUF 树脂:作为胶合板粘合剂的特性和性能
为克服木板用三聚氰胺脲醛树脂(MUF)固化时间长、固化温度高的缺点,在超声波的辅助下,将SiO2和TiO2纳米颗粒分散到MUF树脂中,根据胶粘剂的总质量分别为0%、0.2%、0.4%、0.6%、0.8%和1%,制备了纳米流体MUF树脂胶粘剂。纳米流体胶粘剂优良的导热性能消除了MUF树脂的缺陷。当SiO2和TiO2纳米颗粒掺入时,粘度随纳米颗粒浓度的增加而增加,其中SiO2纳米颗粒(1.0%水平)和TiO2纳米颗粒(1.0%水平)的最大粘度分别增加13.4%和11.4%,随着纳米颗粒掺入水平的增加,MUF树脂的保温寿命、固化时间和游离甲醛含量均有不同程度的下降。SiO2纳米颗粒(0.2%)和TiO2纳米颗粒(0.2%)分别使锅龄最大降低38.5%和36.0%,SiO2纳米颗粒(0.4%)和TiO2纳米颗粒(0.6%)分别使固化时间最大降低13.3%和13.6%,SiO2纳米颗粒(1.0%)和TiO2纳米颗粒(1.0%)分别使游离甲醛含量最大降低32.3%和41.9%。采用与胶合板制造相同的热压方法处理后,纳米流体MUF树脂比纯MUF树脂具有更高的结合强度和更低的甲醛释放量。当热压温度为100℃,热压时间为60 s/mm时,SiO2纳米颗粒(1.0%)和TiO2纳米颗粒(1.0%)的最大结合强度分别提高28.8%和25.4%。当热压温度为110℃,热压时间为40 s/mm时,SiO2纳米颗粒(1.0%)和TiO2纳米颗粒(1.0%)的最大甲醛释放量分别降低46.3%和46.3%。此外,用于胶合板制造的纳米流体MUF树脂降低了热压温度或缩短了热压所需的时间。
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来源期刊
European Journal of Wood and Wood Products
European Journal of Wood and Wood Products 工程技术-材料科学:纸与木材
CiteScore
5.40
自引率
3.80%
发文量
124
审稿时长
6.0 months
期刊介绍: European Journal of Wood and Wood Products reports on original research and new developments in the field of wood and wood products and their biological, chemical, physical as well as mechanical and technological properties, processes and uses. Subjects range from roundwood to wood based products, composite materials and structural applications, with related jointing techniques. Moreover, it deals with wood as a chemical raw material, source of energy as well as with inter-disciplinary aspects of environmental assessment and international markets. European Journal of Wood and Wood Products aims at promoting international scientific communication and transfer of new technologies from research into practice.
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