Bending results of graphene origami reinforced doubly curved shell

IF 5 Q1 ENGINEERING, MULTIDISCIPLINARY
Nan Yang , Yunhe Zou , Mohammad Arefi
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引用次数: 0

Abstract

The present work investigates higher order stress, strain and deformation analyses of a shear deformable doubly curved shell manufactures by a Copper (Cu) core reinforced with graphene origami auxetic metamaterial subjected to mechanical and thermal loads. The effective material properties of the graphene origami auxetic reinforced Cu matrix are developed using micromechanical models cooperate both material properties of graphene and Cu in terms of temperature, volume fraction and folding degree. The principle of virtual work is used to derive governing equations with accounting thermal loading. The numerical results are analytically obtained using Navier's technique to investigate impact of significant parameters such as thermal loading, graphene amount, folding degree and directional coordinate on the stress, strain and deformation responses of the structure. The graphene origami materials may be used in aerospace vehicles and structures and defence technology because of their low weight and high stiffness. A verification study is presented for approving the formulation, solution methodology and numerical results.

石墨烯折纸增强双弯曲壳的弯曲结果
本文研究了在机械和热载荷作用下,由石墨烯折纸形变超材料增强铜(Cu)芯制造的剪切变形双弯曲壳的高阶应力、应变和变形分析。利用石墨烯和铜材料在温度、体积分数和折叠度方面的微观力学模型,研究了石墨烯折纸增强铜基体的有效材料性能。利用虚功原理推导了考虑热负荷的控制方程。利用Navier’s技术解析得到数值结果,研究了热载荷、石墨烯用量、折叠度和方向坐标等重要参数对结构应力、应变和变形响应的影响。石墨烯折纸材料由于其重量轻、刚度高,可用于航空航天飞行器、结构和国防技术。提出了一项验证研究,以批准公式,求解方法和数值结果。
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来源期刊
Defence Technology(防务技术)
Defence Technology(防务技术) Mechanical Engineering, Control and Systems Engineering, Industrial and Manufacturing Engineering
CiteScore
8.70
自引率
0.00%
发文量
728
审稿时长
25 days
期刊介绍: Defence Technology, a peer reviewed journal, is published monthly and aims to become the best international academic exchange platform for the research related to defence technology. It publishes original research papers having direct bearing on defence, with a balanced coverage on analytical, experimental, numerical simulation and applied investigations. It covers various disciplines of science, technology and engineering.
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