{"title":"Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part II","authors":"Kirk A. Martin","doi":"10.31399/asm.edfa.2023-1.p016","DOIUrl":null,"url":null,"abstract":"Abstract The processes and considerations for locally thinning an area of interest to the desired remaining silicon thickness are described.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2023-1.p016","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
Abstract The processes and considerations for locally thinning an area of interest to the desired remaining silicon thickness are described.
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