{"title":"Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive","authors":"Kuan Lai Khei, Liew Chiun Ning, Goh Lay Lay, Wu Jia Jun, Sailesh Suthar","doi":"10.31399/asm.cp.istfa2023p0190","DOIUrl":null,"url":null,"abstract":"Abstract It has been a challenge to perform failure analysis for miniaturization of process node technology in high-speed transceiver. Failure analysis plays an important role in root cause analysis to enable R&D, product quality & reliabily improvement. This paper demonstrated an effective FA approach on a real case with ADPLL functional failure within a high-Speed transceiver in complex sub-nano FPGA. This successful case is achieved by incorporating Analog Probe (APROBE), Infrared Emission Microscopy (IREM), extensive layout study, delayering, Nanoprobing and Scanning Electron Microscopy (SEM) for defect localization.","PeriodicalId":20443,"journal":{"name":"Proceedings","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2023p0190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Abstract It has been a challenge to perform failure analysis for miniaturization of process node technology in high-speed transceiver. Failure analysis plays an important role in root cause analysis to enable R&D, product quality & reliabily improvement. This paper demonstrated an effective FA approach on a real case with ADPLL functional failure within a high-Speed transceiver in complex sub-nano FPGA. This successful case is achieved by incorporating Analog Probe (APROBE), Infrared Emission Microscopy (IREM), extensive layout study, delayering, Nanoprobing and Scanning Electron Microscopy (SEM) for defect localization.