Electrical Fault Isolation of Stuck at Reset Hard Failures

Amrutha Sampath, Carey Wu, Kristofor Dickson
{"title":"Electrical Fault Isolation of Stuck at Reset Hard Failures","authors":"Amrutha Sampath, Carey Wu, Kristofor Dickson","doi":"10.31399/asm.cp.istfa2023p0054","DOIUrl":null,"url":null,"abstract":"Abstract Hard failures, especially the Stuck at Reset failures insensitive to voltage, frequency, and temperature, are among the toughest to debug using the conventional Electrical Fault Isolation Methodology. These types of failures have no test data and no diagnostic information. Because of the failure being stuck at the reset sequence and being a hard failure, methodologies like Laser-Assisted Device Alteration (LADA) cannot be carried out. Photon Emission Microscopy (PEM) may exhibit numerous differences for good vs. bad die, however, most emission signatures typically indicate where IP is stuck in reset but do not indicate the actual root cause. Laser Voltage Probe (LVP) is the most logical way to proceed, but since Power-on Reset (POR) signals typically transition only once per test in conjunction with hard power cycling, the LVP averaging became very difficult as the hard power cycling increased the time of the loop drastically. This paper discusses a novel methodology of modulating power supply voltages within a looping pattern to optically probe the critical internal POR signal transitions effectively and debug the power sequencing of the device. This method is carried out through a custom test setup where a particular power supply of interest is modulated within the test loop without powering down other supplies connected, thereby avoiding the time penalty required for complete power down and power up. The method also synchronizes internal signals associated with POR to a tester-generated trigger in order to successfully obtain recognizable internally extracted POR-associated waveforms. This methodology is conveyed by explaining a complex functional failure analysis case study while highlighting where conventional failure analysis methods could not be used directly to identify the root cause of failure. This paper also describes another case study to explain how parametric information, such as the current profile using the current probe obtained during the test on a pass vs. fail device, can provide valuable information and help debug stuck-in reset failures.","PeriodicalId":20443,"journal":{"name":"Proceedings","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2023p0054","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Abstract Hard failures, especially the Stuck at Reset failures insensitive to voltage, frequency, and temperature, are among the toughest to debug using the conventional Electrical Fault Isolation Methodology. These types of failures have no test data and no diagnostic information. Because of the failure being stuck at the reset sequence and being a hard failure, methodologies like Laser-Assisted Device Alteration (LADA) cannot be carried out. Photon Emission Microscopy (PEM) may exhibit numerous differences for good vs. bad die, however, most emission signatures typically indicate where IP is stuck in reset but do not indicate the actual root cause. Laser Voltage Probe (LVP) is the most logical way to proceed, but since Power-on Reset (POR) signals typically transition only once per test in conjunction with hard power cycling, the LVP averaging became very difficult as the hard power cycling increased the time of the loop drastically. This paper discusses a novel methodology of modulating power supply voltages within a looping pattern to optically probe the critical internal POR signal transitions effectively and debug the power sequencing of the device. This method is carried out through a custom test setup where a particular power supply of interest is modulated within the test loop without powering down other supplies connected, thereby avoiding the time penalty required for complete power down and power up. The method also synchronizes internal signals associated with POR to a tester-generated trigger in order to successfully obtain recognizable internally extracted POR-associated waveforms. This methodology is conveyed by explaining a complex functional failure analysis case study while highlighting where conventional failure analysis methods could not be used directly to identify the root cause of failure. This paper also describes another case study to explain how parametric information, such as the current profile using the current probe obtained during the test on a pass vs. fail device, can provide valuable information and help debug stuck-in reset failures.
复位时硬盘故障的电气故障隔离
硬故障,特别是对电压、频率和温度不敏感的复位故障,是传统电气故障隔离方法最难调试的故障之一。这些类型的故障没有测试数据,也没有诊断信息。由于故障卡在复位序列上,是硬故障,因此无法进行激光辅助设备改造(Laser-Assisted Device change, LADA)等方法。光子发射显微镜(PEM)可能会显示出好与坏模具的许多差异,然而,大多数发射特征通常表明IP卡在重置中的位置,但不能指出实际的根本原因。激光电压探头(LVP)是最符合逻辑的方法,但由于开机复位(POR)信号通常与硬功率循环一起在每次测试中只转换一次,因此随着硬功率循环急剧增加环路的时间,LVP的平均变得非常困难。本文讨论了一种在环路模式下调制电源电压的新方法,以有效地光学探测关键的内部POR信号转换并调试器件的功率顺序。这种方法是通过一个定制的测试设置来实现的,其中在测试环路内调制感兴趣的特定电源,而不关闭连接的其他电源,从而避免了完全断电和上电所需的时间损失。该方法还将与POR相关的内部信号同步到测试仪生成的触发器,以便成功地获得可识别的内部提取的POR相关波形。该方法通过解释一个复杂的功能故障分析案例研究来传达,同时强调传统的故障分析方法不能直接用于识别故障的根本原因。本文还描述了另一个案例研究,以解释参数信息如何提供有价值的信息,并帮助调试卡住的复位故障,例如在通过与失败设备的测试期间使用电流探针获得的电流概况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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