Tomography of Electrical Data in Advanced-Node SRAMs

Gregory M. Johnson, Frank Hitzel
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Abstract

Abstract A commercially available 6T SRAM was examined with an AFM-in-SEM system. A conductive AFM measurement was taken using an AC bias on the backside of the sample with a linear amplifier on the data. Then using a cone-shaped, diamond AFM tip, subsequent scans were made over the field of view at increasingly higher downforce until areas of the chip were worn away. The results provide a survey of implants and structure milling from contact level through the wells of the device. An additional experiment was performed with EBAC.
高级节点sram的电数据断层扫描
摘要:用AFM-in-SEM系统对市售的6T SRAM进行了检测。导电AFM测量采用在样品背面的交流偏压和数据上的线性放大器。然后使用锥形的钻石AFM尖端,在越来越高的下压力下对视场进行后续扫描,直到芯片的区域被磨损。结果提供了从接触水平到设备井的植入物和结构铣削的调查。另外用EBAC进行了实验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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1
审稿时长
11 weeks
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