Pascal Romer, Kishan Bharatbhai Pethani, Andreas J. Beinert
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引用次数: 0
Abstract
In contrast to homogeneous mechanical load according to IEC 61215, photovoltaic modules in the field are mainly exposed to inhomogeneous loads like snow or wind. This paper deals with such inhomogeneous loads using computational fluid dynamics and finite element method simulations. Temperatures different to room temperature and the choice of encapsulates have significant influences on the thermomechanics of a photovoltaic module in case of snow load. Polyolefin is the encapsulant with the lowest storage modulus and has the lowest overall stress in solar cells and glass down to −30°C. Furthermore, with colder temperatures, the first principal stress decreases in solar cells but increases in the glass. For wind loads, the impact of module orientation, wind direction, module inclination angle, and wind speed is analyzed. A crosswind scenario is found to be most critical. Additionally, as a rule of thumb, higher module inclination angles result in higher stresses. Finally, general thermomechanical rules are extracted allowing for a deeper understanding of the underlying effects and therefore help to build more robust modules in the future.
期刊介绍:
Progress in Photovoltaics offers a prestigious forum for reporting advances in this rapidly developing technology, aiming to reach all interested professionals, researchers and energy policy-makers.
The key criterion is that all papers submitted should report substantial “progress” in photovoltaics.
Papers are encouraged that report substantial “progress” such as gains in independently certified solar cell efficiency, eligible for a new entry in the journal''s widely referenced Solar Cell Efficiency Tables.
Examples of papers that will not be considered for publication are those that report development in materials without relation to data on cell performance, routine analysis, characterisation or modelling of cells or processing sequences, routine reports of system performance, improvements in electronic hardware design, or country programs, although invited papers may occasionally be solicited in these areas to capture accumulated “progress”.