Interfacial Instability of Two Bonded Elastic Bodies Driven by Interface or Bulk Residual Stress

IF 4.6 Q2 MATERIALS SCIENCE, BIOMATERIALS
C. Q. Ru
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引用次数: 0

Abstract

Inspired by recent research interest in the interface wrinkling of bonded materials in diverse areas of 3D printing, the present work studies the interfacial instability of two bonded elastic bodies driven by negative interfacial tension or compressible bulk residual stress. For interfacial instability modes decaying exponentially with distance from the interface, the present model is formulated for two bonded elastic half-spaces with a planar interface under plane strain. An explicit expression is given for the wavenumber of interfacial instability driven by negative interfacial tension, and a critical condition is derived for interfacial instability driven by compressive bulk residual stress. The derived results are validated with comparison to known results on surface instability of an elastic half-space, and the role of shear modulus ratio and Poisson’s ratios of two bonded elastic bodies in interfacial instability, an issue to be addressed in literature, is studied with specific reference to material parameters used in some areas of 3D printing.

Abstract Image

界面或整体残余应力驱动下两个结合弹性体的界面不稳定性
受最近对3D打印不同领域粘结材料界面起皱的研究兴趣的启发,本工作研究了两个粘结弹性体在负界面张力或可压缩体残余应力驱动下的界面不稳定性。对于界面失稳模式随距离呈指数衰减的情况,建立了平面应变作用下具有平面界面的两个键合弹性半空间的模型。给出了负界面张力驱动界面失稳波数的显式表达式,导出了压体残余应力驱动界面失稳的临界条件。将所得结果与已知的弹性半空间表面不稳定性结果进行对比,验证了所得结果的有效性,并结合3D打印中使用的材料参数,研究了两个键合弹性体的剪切模量比和泊松比在界面不稳定性中的作用,这是文献中有待解决的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
ACS Applied Bio Materials
ACS Applied Bio Materials Chemistry-Chemistry (all)
CiteScore
9.40
自引率
2.10%
发文量
464
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