Exploration of high-speed 3.0 THz imaging with a 65 nm CMOS process

IF 4.8 4区 物理与天体物理 Q2 PHYSICS, CONDENSED MATTER
Min Liu, Ziteng Cai, Jian Liu, Nanjian Wu, Liyuan Liu
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引用次数: 0

Abstract

Abstract This paper describes a promising route for the exploration and development of 3.0 THz sensing and imaging with FET-based power detectors in a standard 65 nm CMOS process. Based on the plasma-wave theory proposed by Dyakonov and Shur, we designed high-responsivity and low-noise multiple detectors for monitoring a pulse-mode 3.0 THz quantum cascade laser (QCL). Furthermore, we present a fully integrated high-speed 32 × 32-pixel 3.0 THz CMOS image sensor (CIS). The full CIS measures 2.81 × 5.39 mm 2 and achieves a 423 V/W responsivity (Rv) and a 5.3 nW integral noise equivalent power (NEP) at room temperature. In experiments, we demonstrate a testing speed reaching 319 fps under continuous-wave (CW) illumination of a 3.0 THz QCL. The results indicate that our terahertz CIS has excellent potential in cost-effective and commercial THz imaging and material detection.
利用65纳米CMOS工艺探索3.0太赫兹高速成像
本文介绍了在标准65nm CMOS工艺中,利用基于fet的功率探测器探索和开发3.0 THz传感和成像的一条有前途的路线。基于Dyakonov和Shur提出的等离子体波理论,设计了用于监测脉冲模3.0 THz量子级联激光器(QCL)的高响应、低噪声多重探测器。此外,我们提出了一个完全集成的高速32 × 32像素3.0太赫兹CMOS图像传感器(CIS)。完整的CIS尺寸为2.81 × 5.39 mm 2,在室温下实现423 V/W的响应度(Rv)和5.3 nW的积分噪声等效功率(NEP)。在实验中,我们演示了在3.0太赫兹QCL连续波(CW)照明下的测试速度达到319 fps。结果表明,我们的太赫兹CIS在成本效益和商业太赫兹成像和材料检测方面具有良好的潜力。
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来源期刊
Journal of Semiconductors
Journal of Semiconductors PHYSICS, CONDENSED MATTER-
CiteScore
6.70
自引率
9.80%
发文量
119
期刊介绍: Journal of Semiconductors publishes articles that emphasize semiconductor physics, materials, devices, circuits, and related technology.
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