{"title":"An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric Carriers","authors":"Weiyu Zhang, Yuan Zhao, Zhongwei Liu, Stone Cheng","doi":"10.4071/001c.88424","DOIUrl":null,"url":null,"abstract":"Conductive assembly film adhesives are extensively employed in medical, telecom, aerospace, and defense systems. Glass fabric cloth is frequently utilized as the carrier in many film adhesives to enhance handling and processability during electronic device assembly. Furthermore, practical applications have shown that film adhesives with glass fabric carriers can bond adherends with severely mismatched coefficients of thermal expansion. However, the impact of embedding glass fabric on the overall performance of assembly films has not been systematically investigated. To address this gap in knowledge, a study was conducted to compare the performance of electrically conductive film adhesives with and without the glass fabric carriers. The study focused on the mechanical performance of the film adhesives, including lap shear strength, tensile modulus, and the ability to manage applications with mismatched coefficients of thermal expansion. Additionally, the study assessed the impact of the carrier on the electrical and thermal conductivity of the film adhesives. Overall, this integrated assessment provides insights into the effectiveness of the glass fabric carrier on the performance of film adhesives.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/001c.88424","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
Conductive assembly film adhesives are extensively employed in medical, telecom, aerospace, and defense systems. Glass fabric cloth is frequently utilized as the carrier in many film adhesives to enhance handling and processability during electronic device assembly. Furthermore, practical applications have shown that film adhesives with glass fabric carriers can bond adherends with severely mismatched coefficients of thermal expansion. However, the impact of embedding glass fabric on the overall performance of assembly films has not been systematically investigated. To address this gap in knowledge, a study was conducted to compare the performance of electrically conductive film adhesives with and without the glass fabric carriers. The study focused on the mechanical performance of the film adhesives, including lap shear strength, tensile modulus, and the ability to manage applications with mismatched coefficients of thermal expansion. Additionally, the study assessed the impact of the carrier on the electrical and thermal conductivity of the film adhesives. Overall, this integrated assessment provides insights into the effectiveness of the glass fabric carrier on the performance of film adhesives.
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.