Vector Field Based Volume Peeling for Multi-Axis Machining

IF 2.6 3区工程技术 Q2 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS

Journal of Computing and Information Science in Engineering Pub Date : 2023-10-20 DOI:10.1115/1.4063861

Neelotpal Dutta, Tianyu Zhang, Guoxin Fang, Ismail E. Yigit, Charlie C.L. Wang

引用次数: 0

Abstract

Abstract This paper presents an easy-to-control volume peeling method for multi-axis machining based on the computation taken on vector fields. The current scalar field based methods are not flexible and the vector-field based methods do not guarantee the satisfaction of the constraints in the final results. We first conduct an optimization formulation to compute an initial vector field that is well aligned with those anchor vectors specified by users according to different manufacturing requirements. The vector field is further optimized to be an irrotational field so that it can be completely realized by a scalar field's gradients. Iso-surfaces of the scalar field will be employed as the layers of working surfaces for multi-axis volume peeling in the rough machining. Algorithms are also developed to remove and process singularities of the fields. Our method has been tested on a variety of models and verified by physical experimental machining.

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基于矢量场的多轴加工体剥离

摘要提出了一种基于向量场计算的易控制的多轴加工体积剥离方法。目前基于标量场的方法缺乏灵活性，基于向量场的方法不能保证最终结果满足约束条件。我们首先进行优化公式计算初始向量场，该初始向量场与用户根据不同制造要求指定的锚向量对齐良好。将矢量场进一步优化为无旋转场，完全可以通过标量场的梯度来实现。在粗加工中，将标量场的等曲面作为多轴体剥离的工作表面层。此外，还开发了去除和处理奇异场的算法。我们的方法已经在多种模型上进行了测试，并通过物理实验加工进行了验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Computing and Information Science in Engineering 工程技术-工程：制造

CiteScore

6.30

自引率

12.90%

发文量

100

审稿时长

6 months

期刊介绍： The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications. Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping