AlGaN High Electron Mobility Transistor for High Temperature Logic

B.A. Klein, A.A. Allerman, A.G. Baca, C.D Nordquist, A.M. Armstrong, M. Van Heukelom, A. Rice, V. Patel, M. Rosprim, L. Caravello, R. DeBerry, J.R. Pipkin, V.M. Abate, R.J. Kaplar
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Abstract

We report on AlGaN HEMT-based logic development, using combined enhancement- and depletion-mode transistors to fabricate inverters with operation from room temperature up to 500°C. Our development approach included: (a) characterizing temperature dependent carrier transport for different AlGaN HEMT heterostructures, (b) developing a suitable gate metal scheme for use in high temperatures, and (c) over-temperature testing of discrete devices and inverters. Hall mobility data revealed the GaN-channel HEMT experienced a 6.9× reduction in mobility, whereas the AlGaN channel HEMTs experienced about a 3.1x reduction. Furthermore, a greater aluminum contrast between the barrier and channel enabled higher carrier densities in the two-dimensional electron gas for all temperatures. The combination of reduced variation in mobility with temperature and high sheet carrier concentration showed that an Al-rich AlGaN-channel HEMT with a high barrier-to-channel aluminum contrast is the best option for an extreme temperature HEMT design. Three gate metal stacks were selected for low resistivity, high melting point, low thermal expansion coefficient, and high expected barrier height. The impact of thermal cycling was examined through electrical characterization of samples measured before and after rapid thermal anneal. The 200 nm tungsten gate metallization was the top performer with minimal reduction in drain current, a slightly positive threshold voltage shift, and about an order of magnitude advantage over the other gates in on-to-off current ratio. After incorporating the tungsten gate metal stack in device fabrication, characterization of transistors and inverters from room temperature up to 500°C was performed. The enhancement-mode (e-mode) devices’ resistance started increasing at about 200°C, resulting in drain current degradation. This phenomenon was not observed in depletion-mode (d-mode) devices but highlights a challenge for inverters in an e-mode driver and d-mode load configuration.
用于高温逻辑的高电子迁移率晶体管
我们报告了基于AlGaN hemt的逻辑开发,使用组合增强模式和耗尽模式晶体管来制造从室温到500°C工作的逆变器。我们的开发方法包括:(a)表征不同AlGaN HEMT异质结构的温度相关载流子输运,(b)开发适用于高温的栅极金属方案,以及(c)离散器件和逆变器的过温测试。霍尔迁移率数据显示,gan通道HEMT的迁移率降低了6.9倍,而AlGaN通道HEMT的迁移率降低了3.1倍。此外,屏障和通道之间更大的铝反差使得二维电子气体在所有温度下都具有更高的载流子密度。迁移率随温度变化的减小和高载流子浓度的结合表明,富al的algan通道HEMT具有高通道铝的阻隔性,是极端温度HEMT设计的最佳选择。选择了三种具有低电阻率、高熔点、低热膨胀系数和高期望垒高的栅极金属堆。通过快速热退火前后测量的样品的电特性来检查热循环的影响。200 nm钨栅极金属化是性能最好的,漏极电流降低最小,阈值电压偏移略为正,并且在通断电流比上比其他栅极有一个数量级的优势。在器件制造中加入钨栅极金属堆栈后,在室温至500°C范围内进行了晶体管和逆变器的表征。在大约200°C时,增强模式(e-mode)器件的电阻开始增加,导致漏极电流下降。这种现象在耗尽模式(d模式)设备中没有观察到,但突出了e模式驱动和d模式负载配置中的逆变器的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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