High-Frequency Parametric Study of Electroplated Conductive Filaments in 3D Printed Microwave Topologies

IF 2.3 4区工程技术 Q3 ENGINEERING, MANUFACTURING

3D Printing and Additive Manufacturing Pub Date : 2023-11-07 DOI:10.1089/3dp.2023.0074

Rolando Salazar, Dreidy Vasquez, Gabriel Hermosilla, Eva Rajo-Iglesias, Francisco Pizarro

引用次数: 0

Abstract

This article presents a high-frequency characterization from 1 up to 10 GHz of electroplated conductive filaments in 3D printed microwave topologies. This study implements different microstrip lines and antennas to compare their performance as-is and with the electroplating process. The results for the microstrip lines show a significant decrease in losses for the electroplated devices, even reaching loss levels of pure copper devices. In addition, considerations about the required thickness for the conductor are analyzed by considering the skin depth requirement for nonideal conductors. The results for a patch antenna measurement confirm that the antenna height can be reduced to extremely low levels.

查看原文本刊更多论文

3D打印微波拓扑中电镀导电丝的高频参数研究

本文介绍了3D打印微波拓扑中电镀导电丝从1到10 GHz的高频特性。本研究实现了不同的微带线和天线，比较了其与电镀工艺的性能。微带线的结果表明，电镀器件的损耗显著降低，甚至达到纯铜器件的损耗水平。此外，通过考虑非理想导体的趋肤深度要求，分析了导体所需厚度的考虑因素。贴片天线测量的结果证实，天线高度可以降低到极低的水平。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)

CiteScore

6.00

自引率

6.50%

发文量

126

期刊介绍： 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.