Deep-Learning-Based 3-D Surface Reconstruction—A Survey

IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Anis Farshian;Markus Götz;Gabriele Cavallaro;Charlotte Debus;Matthias Nießner;Jón Atli Benediktsson;Achim Streit
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引用次数: 0

Abstract

In the last decade, deep learning (DL) has significantly impacted industry and science. Initially largely motivated by computer vision tasks in 2-D imagery, the focus has shifted toward 3-D data analysis. In particular, 3-D surface reconstruction, i.e., reconstructing a 3-D shape from sparse input, is of great interest to a large variety of application fields. DL-based approaches show promising quantitative and qualitative surface reconstruction performance compared to traditional computer vision and geometric algorithms. This survey provides a comprehensive overview of these DL-based methods for 3-D surface reconstruction. To this end, we will first discuss input data modalities, such as volumetric data, point clouds, and RGB, single-view, multiview, and depth images, along with corresponding acquisition technologies and common benchmark datasets. For practical purposes, we also discuss evaluation metrics enabling us to judge the reconstructive performance of different methods. The main part of the document will introduce a methodological taxonomy ranging from point- and mesh-based techniques to volumetric and implicit neural approaches. Recent research trends, both methodological and for applications, are highlighted, pointing toward future developments.
基于深度学习的三维曲面重建研究综述
在过去十年中,深度学习(DL)对工业和科学产生了重大影响。最初主要是受2-D图像的计算机视觉任务的推动,重点已经转向3-D数据分析。特别是三维曲面重建,即从稀疏输入重建三维形状,是各种应用领域非常感兴趣的。与传统的计算机视觉和几何算法相比,基于dl的方法在定量和定性表面重建方面表现出良好的性能。本调查提供了这些基于dl的三维表面重建方法的全面概述。为此,我们将首先讨论输入数据模式,如体积数据、点云和RGB、单视图、多视图和深度图像,以及相应的采集技术和通用基准数据集。为了实际的目的,我们还讨论了评估指标,使我们能够判断不同方法的重建性能。该文件的主要部分将介绍从基于点和网格的技术到体积和隐式神经方法的方法分类。最近的研究趋势,方法和应用,强调,指向未来的发展。
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来源期刊
Proceedings of the IEEE
Proceedings of the IEEE 工程技术-工程:电子与电气
CiteScore
46.40
自引率
1.00%
发文量
160
审稿时长
3-8 weeks
期刊介绍: Proceedings of the IEEE is the leading journal to provide in-depth review, survey, and tutorial coverage of the technical developments in electronics, electrical and computer engineering, and computer science. Consistently ranked as one of the top journals by Impact Factor, Article Influence Score and more, the journal serves as a trusted resource for engineers around the world.
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