Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations

Abstract

Abstract While the importance of thin form factor and mechanical tissue biocompatibility has been made clear for next generation bioelectronic implants, material systems meeting these criteria still have not demonstrated sufficient long-term durability. This review provides an update on the materials used in modern bioelectronic implants as substrates and protective encapsulations, with a particular focus on flexible and conformable devices. We review how thin film encapsulations are known to fail due to mechanical stresses and environmental surroundings under processing and operating conditions. This information is then reflected in recommending state-of-the-art encapsulation strategies for designing mechanically reliable thin film bioelectronic interfaces. Finally, we assess the methods used to evaluate novel bioelectronic implant devices and the current state of their longevity based on encapsulation and substrate materials. We also provide insights for future testing to engineer long-lived bioelectronic implants more effectively and to make implantable bioelectronics a viable option for chronic diseases in accordance with each patient’s therapeutical timescale.