The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-10-09 DOI:10.1115/1.4063485

Justin Chow, Suresh Sitaraman

{"title":"The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch","authors":"Justin Chow, Suresh Sitaraman","doi":"10.1115/1.4063485","DOIUrl":null,"url":null,"abstract":"Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"30 1","pages":"0"},"PeriodicalIF":2.2000,"publicationDate":"2023-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4063485","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.

查看原文本刊更多论文

单轴拉伸下丝网印刷银墨的电阻网络建模方法

柔性电子器件利用其独特的拉伸、弯曲和扭曲能力，在各种应用中得到广泛应用。建立了单轴应变下印刷导电油墨压阻性能的实验方法。杜邦5025丝网印刷银油墨在Kapton和Melinex承印物上拉伸至承印物失效。Kapton样品被发现在60%左右的应变下破裂，并且在衬底破裂时的相对电阻R/R0约为30-40。在Melinex基板上，油墨在基板破裂之前会发生电失效，但在失效之前可以拉伸到超过130%或更高的应变。Melinex样品中这些高菌株的相对电阻值不稳定，可能超过1000，在一个案例中超过30,000。油墨应变失效与导体宽度有关，较窄的导体先于较宽的导体失效。最后，建立了考虑油墨填料体积分数、粒径分布、接触电阻和电子隧道效应的2.5D RVE模型，该模型可以准确预测5025油墨在60%轴向应变下的压阻行为。一项初步的参数研究发现，增加RVE的体积分数可以改善电气性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.