Converging Jet Impingement for Enhanced Liquid Cooling

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-10-09 DOI:10.1115/1.4063484

Reece Whitt, Rafael Estrella, David Huitink

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Abstract

Abstract Jet impingement cooling is an advanced thermal management technique for high heat flux applications. Standard configurations include single, axisymmetric jets with orifice, slot, or pipe nozzles. This choice in nozzle shape, number of jets, and jet inclination greatly influences the turbulence generated by fluid entrainment due to differences in initial velocity profiles and location of secondary stagnation points. Regarding high power electronics with integrated jet impingement schemes, turbulence, and heat transfer rates must be optimized to meet the extreme cooling requirements. In this study, the heat transfer rates of dual inclined converging jets are investigated experimentally. Emphasis is placed on the comparison of different jet schemes with respect to geometrical parameters including nozzle pitch, incline angle, and nozzle-to-target plate spacing. A parametric experimental investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Computational simulations are used to evaluate the effect of jet configuration on stagnation pressure associated with maximum heat transfer rates, and an empirical Nusselt number model is provided. The results show the effects of convergence height on jet behavior and the associated impacts on heat transfer.

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增强液体冷却的会聚射流冲击

射流冲击冷却是一种适用于高热流密度应用的先进热管理技术。标准配置包括单轴对称射流孔，槽，或管喷嘴。由于初始速度分布和二次滞止点位置的不同，喷嘴形状、射流数量和射流倾角的选择极大地影响了流体夹带产生的湍流。对于集成射流冲击方案的大功率电子器件，必须优化湍流和传热速率以满足极端冷却要求。本文通过实验研究了双倾斜会聚射流的换热速率。重点放在不同的射流方案的几何参数，包括喷嘴间距，倾斜角和喷嘴到目标板间距的比较。参数实验调查进行了比较点使用模块化，增材制造的射流设置。采用计算模拟的方法评价了射流构型对最大传热速率下滞止压力的影响，并给出了经验努塞尔数模型。研究结果表明，收敛高度对射流特性的影响及其对换热的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.