Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
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引用次数: 0

Abstract

Abstract Autonomous vehicles are part of an expanding industry that encompasses various interdisciplinary fields such as dynamic controls, thermal engineering, sensors, data processing, and artificial intelligence. Exposure to extreme environmental conditions, such as changes to temperature and humidity, affects sensor performance. To address potential safety concerns related to sensor perception used in autonomous vehicles in extremely cold real-world situations, specifically Alaska, examination of frosts and water droplets impact on vehicle optical sensors is conducted in both real-world and laboratory-controlled settings. Machine learning models are utilized to determine the vision impediment levels. Potential hardware and software tools are then introduced as solutions for the environmental impacts. Through this research, a better understanding of the potential caveats and algorithm solutions can be suggested to improve autonomous driving, even under challenging weather conditions.
阿拉斯加极端条件下自动驾驶汽车传感器的机器学习分析
自动驾驶汽车是一个不断扩大的行业的一部分,它涵盖了各种跨学科领域,如动态控制、热工程、传感器、数据处理和人工智能。暴露在极端环境条件下,如温度和湿度的变化,会影响传感器的性能。为了解决在极端寒冷的现实环境(特别是阿拉斯加)中自动驾驶汽车使用的传感器感知的潜在安全问题,研究人员在现实世界和实验室控制环境中测试了霜冻和水滴对汽车光学传感器的影响。使用机器学习模型来确定视觉障碍水平。然后介绍潜在的硬件和软件工具,作为环境影响的解决方案。通过这项研究,可以更好地了解潜在的警告和算法解决方案,以改善自动驾驶,即使在恶劣的天气条件下。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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