Effect of the texture of indium on its mechanical properties

Abstract

The mechanics properties of indium bumps connecting optoelectric device is critical to the reliability: Bumps after welding have a very low shear strength, and have a very high tensile strength. The relationship between the texture and strength is studied by analyzing the orientation dependence of resolved shear stress on dislocation slip plane and the effect of shear stress on dislocation initiation. Finally the low shear strength can be explained by that the preferred orientation of glide plane leads to the readiness of dislocation initiation. The high tensile strength can be attributed to the texture strengthening.