{"title":"Protection Power device performance investigation using TCAD simulations","authors":"F. Roqueta, K. Tahri","doi":"10.1109/EUROSIME.2013.6529904","DOIUrl":null,"url":null,"abstract":"The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529904","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.