Protection Power device performance investigation using TCAD simulations

F. Roqueta, K. Tahri
{"title":"Protection Power device performance investigation using TCAD simulations","authors":"F. Roqueta, K. Tahri","doi":"10.1109/EUROSIME.2013.6529904","DOIUrl":null,"url":null,"abstract":"The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529904","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.
利用TCAD仿真研究保护电源器件的性能
本文提出了一种模拟EOS保护装置动态性能的方法。由于在EOS事件期间器件中发生电和热现象的耦合,因此需要进行电热模拟。为了获得对器件行为的准确描述,在不同尺度上对元件进行了模拟:在器件尺度上进行了二维电热模拟,在封装尺度上进行了三维热模拟。这种方法允许理解组件的行为,然后对其进行优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信