{"title":"Achieving 800 MT/s performance with PGA370 socket","authors":"C. Chung, A. Waizman","doi":"10.1109/EPEP.1999.819209","DOIUrl":null,"url":null,"abstract":"This paper describes the innovative solutions that enabled the implementation of high speed I/O (800 MT/s) performance for an integrated RDRAM controller on an Intel Celeron CPU, under low cost constraints of packaging, socket-able solution and 4-layer motherboard.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes the innovative solutions that enabled the implementation of high speed I/O (800 MT/s) performance for an integrated RDRAM controller on an Intel Celeron CPU, under low cost constraints of packaging, socket-able solution and 4-layer motherboard.