{"title":"Micro systems technology: the way to shrink sun sensors","authors":"J. Leijtens, K. Boom, N. V. D. Heiden","doi":"10.1109/ICMENS.2005.68","DOIUrl":null,"url":null,"abstract":"High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.","PeriodicalId":185824,"journal":{"name":"2005 International Conference on MEMS,NANO and Smart Systems","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Conference on MEMS,NANO and Smart Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMENS.2005.68","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.