Effects of annealing temperature on current-voltage characteristics of TiO2 thin film by sol-gel process on silicon substrate for biosensor application

Sh. Nadzirah, U. Hashim
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引用次数: 10

Abstract

TiO2 thin film was deposited on a silicon dioxide substrate using a sol-gel method and the film was annealed at 300, 500 and 700°C. Aluminum interdigitated electrodes were fabricated on the deposited TiO2 thin film via simple lithography method. The influence of thermal annealing towards the morphological and electrical properties were studied. X-ray diffraction (XRD) shows that crystalline rutile structure growth at very low temperature whereas field emission electron microscopy (FESEM) exhibits nanoparticles with an average 21 mm in size. The current flows between the fabricated interdigitated electrodes were extremely small at -5 to 5 V applied which were decreased as the annealing temperature increases with average barrier height was 0.8 eV.
退火温度对溶胶-凝胶法制备生物传感器用二氧化钛薄膜电流-电压特性的影响
采用溶胶-凝胶法将TiO2薄膜沉积在二氧化硅衬底上,并分别在300、500和700℃下退火。采用简单光刻法在沉积的TiO2薄膜上制备了铝交叉电极。研究了热处理对形貌和电学性能的影响。x射线衍射(XRD)表明晶体金红石结构在极低温度下生长,而场发射电子显微镜(FESEM)显示平均尺寸为21 mm的纳米颗粒。在-5 ~ 5 V时,电极间的电流很小,且随着退火温度的升高而减小,平均势垒高度为0.8 eV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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