Influence of surface finish and additional curing on resistance of adhesive conductive joints

Abstract

Electrically conductive adhesives are indispensable materials for mounting some types of electronic components. The resistivity of adhesive joints depends on properties of adhesive, on material and surface quality of connected parts and on a curing schedule of the adhesive. The work is focused on examination the joint resistance in dependence on these parameters. Three types of adhesives with isotropic electrical conductivity have been used for experiments. Adhesives have been applied by stencil printing on the pads having copper and gold surface finish. The joints have been formed by adhesive assembly of jumpers of the type 1206. The strips formed by printing of adhesive between two neighboring pads have also been prepared and measured. Influence of additional curing of the joints on their resistance has been tested with negative results. The results have shown that the joints resistance is dominantly influenced by the curing schedule.