3T-TFET bitcell based TFET-CMOS hybrid SRAM design for Ultra-Low Power applications

N. Gupta, A. Makosiej, A. Vladimirescu, A. Amara, C. Anghel
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引用次数: 14

Abstract

This paper presents a TFET/CMOS hybrid SRAM architecture designed to address the requirements for ULP (Ultra-Low Power) applications, like IoT (Internet of Things). A novel 3-Transistor TFET SRAM cell is used for array while CMOS for periphery. The simulation extractions for power and speed are done including wiring and device parasitic capacitance from 4Kb SRAM designed in 28nm FDSOI CMOS process using MOSFETs & Tunnel FETs (TFETs). The proposed 3T-TFET SRAM cell supports aggressive voltage scaling without impacting data stability and allows application of performance boosting techniques without impacting cell leakage. A 0.35 fA/bit memory array leakage current was achieved showing a 14x to 104x improvement compared with state-of-the-art TFET and CMOS SRAM bitcells. Minimum read and write access pulse is evaluated at 1.27ns at sub-1V supply voltage.
超低功耗应用的3T-TFET位单元TFET-CMOS混合SRAM设计
本文提出了一种ttfet /CMOS混合SRAM架构,旨在满足ULP(超低功耗)应用的需求,如IoT(物联网)。阵列采用一种新型的3晶体管ttfet SRAM单元,外围采用CMOS单元。功率和速度的仿真提取包括使用mosfet和隧道fet (tfet)在28nm FDSOI CMOS工艺中设计的4Kb SRAM的布线和器件寄生电容。提出的3T-TFET SRAM单元支持积极的电压缩放,而不会影响数据稳定性,并且允许应用性能提升技术而不会影响电池泄漏。存储器阵列漏电流达到0.35 fA/位,与最先进的TFET和CMOS SRAM位单元相比,提高了14到104倍。在sub-1V电源电压下,最小读写访问脉冲被评估为1.27ns。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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