Performance analysis of an enhanced PCM thermal control unit

Abstract

This paper reports the investigation of a Thermal Control Unit (TCU) implemented into an electronic device to improve energy management, absorb excessive heat generated by the heat source component in a quick manner and maintain surface temperature below critical limits. The TCU is made of an organic Phase Change Material (PCM) and a Thermal Conductivity Enhancer (TCE), composed of aluminum fins. The effect of the fin distribution on the performance of the TCU is investigated over a range of operation conditions. To quantify the improvements of the TCU with the TCE, it is compared with the baseline case of TCU without TCE. Results illustrate significant effects of the TCE for both constant and variable power operations. In a constant power operation, the TCE helps to keep the TCU temperature uniform and constant during PCM melting, in which overheating of the PCM is prevented. During variable power operations, the TCE helps to reduce fluctuating temperatures in the TCU, with a reduction in maximum temperature of 10/spl deg/C.