Co-integrated dual strained channels on fully depleted sSDOI CMOSFETs with HfO/sub 2//TiN gate stack down to 15nm gate length

F. Andrieu, T. Ernst, O. Faynot, Y. Bogumilowicz, J. Hartmann, J. Eymery, D. Lafond, Y. Levaillant, C. Dupré, R. Powers, F. Fournel, C. Fenouillet-Béranger, A. Vandooren, B. Ghyselen, C. Mazure, N. Kernevez, G. Ghibaudo, S. Deleonibus
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引用次数: 18

Abstract

We report an original dual channel fully depleted CMOSFET architecture on insulator (DCOI) co-integrating strained-Si (nMOS) and strained-Si/sub 0.6/Ge/sub 0.4/ (pMOS) with HfO/sub 2//TiN gate stacks down to 15nm gate length. We demonstrate for the first time an I/sub ON/ improvement for short channel SOI of 10% at 35nm gate length (25% at 75nm, 100% on long channels) for both n- and p-MOSFETs and a more than 3 decades gate leakage reduction compared to a SiO/sub 2/ dielectric. Meanwhile, thanks to the dual channel engineering, a threshold voltage adjustment is performed with a mid gap single metal gate suitable for high performance (HP) CMOS.
基于HfO/sub 2/ TiN栅极叠加至15nm栅极长度的全耗尽sSDOI cmosfet的共集成双应变通道
我们报道了一种原始的双通道全耗尽CMOSFET结构,该结构基于绝缘子(DCOI)共积应变si (nMOS)和应变si /sub 0.6/Ge/sub 0.4/ (pMOS), HfO/sub 2//TiN栅极堆叠栅极长度为15nm。我们首次证明了n-和p- mosfet在35nm栅极长度下的I/sub - ON/短沟道SOI的改进(在75nm下为25%,在长沟道上为100%),并且与SiO/sub - 2/介电介质相比,栅极泄漏减少了30多年。同时,由于双通道工程,阈值电压调整是由适合高性能(HP) CMOS的中隙单金属栅极进行的。
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