Robert C Frye, G. Badakere, Yaojian Lin, M. Pandi Chelvam
{"title":"A monolithic, compact balun/matching network for SiP applications","authors":"Robert C Frye, G. Badakere, Yaojian Lin, M. Pandi Chelvam","doi":"10.1109/EPEP.2004.1407540","DOIUrl":null,"url":null,"abstract":"We describe a circuit and design method for a compact balun/matching network suitable for a variety of RF application using thin-film integrated passive device (IPD) technology. The circuit uses resonant coupled inductors. By appropriate tuning of the capacitors in the circuit, the balun can be made to match a wide range of impedances. Measured results of example circuits for 802.11 b/g or Bluetooth applications (2.4-2.5 GHz) are presented, showing excellent agreement with simulation.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407540","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
We describe a circuit and design method for a compact balun/matching network suitable for a variety of RF application using thin-film integrated passive device (IPD) technology. The circuit uses resonant coupled inductors. By appropriate tuning of the capacitors in the circuit, the balun can be made to match a wide range of impedances. Measured results of example circuits for 802.11 b/g or Bluetooth applications (2.4-2.5 GHz) are presented, showing excellent agreement with simulation.