Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives

Abstract

A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.