{"title":"The Influence of a Chrome Film Bonding Layer on SAW Resonator Performance","authors":"W. Tanski","doi":"10.1109/ULTSYM.1985.198513","DOIUrl":null,"url":null,"abstract":"We have been working to make low aging rate, low phase noise SAW resonator oscillators for systems applications. These resonators are normally made using A1 electrodes, frequently including a Cr film bonding layer, and the resonators are often secured to a header u sing an adhesive. Here we report the results of tests to determine the i nfluence of a Cr bonding layer on device n oise levels and the effect of the high temperature bake (needed for adhesive cure) on a resonator frequency r esponse. It was found that a Cr film bonding caused an increase in the single side band phase noise (measured and the 1Hz intercept) of 15 dBc on average. High temperature b aking (35OoC) resulted in a significant and variable frequency shift as well a small changes in loss and Q. Physical analyses show Cr to be highly mobile, and significant oxidation of the A1 occurs when heated in air.","PeriodicalId":240321,"journal":{"name":"IEEE 1985 Ultrasonics Symposium","volume":"581 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1985 Ultrasonics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.1985.198513","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
We have been working to make low aging rate, low phase noise SAW resonator oscillators for systems applications. These resonators are normally made using A1 electrodes, frequently including a Cr film bonding layer, and the resonators are often secured to a header u sing an adhesive. Here we report the results of tests to determine the i nfluence of a Cr bonding layer on device n oise levels and the effect of the high temperature bake (needed for adhesive cure) on a resonator frequency r esponse. It was found that a Cr film bonding caused an increase in the single side band phase noise (measured and the 1Hz intercept) of 15 dBc on average. High temperature b aking (35OoC) resulted in a significant and variable frequency shift as well a small changes in loss and Q. Physical analyses show Cr to be highly mobile, and significant oxidation of the A1 occurs when heated in air.