The MATRICs RF-FPGA in 180nm SiGe-on-SOI BiCMOS

L. Kushner, Kevin Sliech, G. Flewelling, Joseph Cali, C. Grens, S. E. Turner, D. Jansen, J. L. Wood, Gary M. Madison
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引用次数: 16

Abstract

MATRICs (Microwave Array Technology for Reconfigurable Integrated Circuits) is a DC-to-20 GHz general purpose reconfigurable array of RF circuits embedded in a flexible switch fabric. Fabricated in a commercial SiGe-on-SOI BiCMOS process, the MATRICs IC employs SiGe HBTs for high-linearity (> + 10 dBm IIP3) amplification and low phase-noise frequency generation, and SOI FETs for low-loss switching. It achieves high on-chip RF isolation (>80 dB at 16 GHz) due to the high-resistivity SOI substrate, differential signalling, and chip-scale flip-chip bump packaging. MATRICs will allow fixed-function RF systems to have the size, weight, and power benefits of a custom RF ASIC without the associated long development cycle and high NRE, and enable future RF subsystems to be dynamically reconfigured on-the-fly, adapting to changing environments.
矩阵射频fpga在180nm sigon - soi BiCMOS
矩阵(用于可重构集成电路的微波阵列技术)是一种dc至20 GHz的通用可重构射频电路阵列,嵌入在灵活的开关结构中。matrix IC采用商用SiGe-on-SOI BiCMOS工艺制造,采用SiGe hbt实现高线性(> + 10 dBm IIP3)放大和低相位噪声频率产生,采用SOI fet实现低损耗开关。由于采用高电阻率SOI衬底、差分信号和芯片级倒装芯片碰撞封装,它实现了高片上射频隔离(> 80db, 16 GHz)。matrix将允许固定功能RF系统具有定制RF ASIC的尺寸、重量和功率优势,而无需相关的长开发周期和高NRE,并使未来的RF子系统能够动态重新配置,以适应不断变化的环境。
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