Effect of 300 mm wafer and small lot size on final test process efficiency and cost of LSI manufacturing system

Abstract

The effect of lot size change on the current final test process efficiency and cost due to the transition of from conventional 5 or 6 inches to 300 mm (12 inches) in wafer size is evaluated through simulation analysis. Results show that high test efficiency and low test cost are maintained regardless of lot size in the 300 mm wafer range from one sheet to 25 sheets by using an appropriate dispatching rule and a small processing and moving lot size close to the batch size of testing equipment in the final test process.