On the superiority of DO-RE-ME/MPG-D over stuck-at-based defective part level prediction

Jennifer Dworak, M. Grimaila, Brad Cobb, Ting-Chi Wang, Li-C. Wang, M. R. Mercer
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引用次数: 8

Abstract

Uses data collected from benchmark circuit simulations to examine the relationship between the tests which detect stuck-at faults and those which detect bridging surrogates. We show that the coefficient of correlation between these tests approaches zero as the stuck-at fault coverage approaches 100%. An enhanced version of the MPG-D model, which is based upon the number of detections of each site in a logic circuit, is shown to be superior to stuck-at fault coverage-based defective part level prediction. We then compare the accuracy of both predictors for an industrial circuit tested using two different test pattern sequences.
DO-RE-ME/MPG-D相对于基于卡滞的缺陷件水平预测的优越性
使用从基准电路模拟中收集的数据来检查检测卡滞故障的测试和检测桥接代理的测试之间的关系。我们表明,当卡在故障覆盖率接近100%时,这些测试之间的相关系数趋于零。MPG-D模型的增强版本基于逻辑电路中每个位点的检测数量,被证明优于基于故障覆盖的缺陷部件级别预测。然后,我们比较了两个预测器的精度为工业电路测试使用两种不同的测试模式序列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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