New way to manage high density signal connections and the small power of sub-K cryo-generators

J. Sauvageot, A. Olivier, J. Charbonnier, X. de la Broïse, C. Thomas, G. Gay, S. David, F. Gustavo, T. Charvolin
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Abstract

The small power of cryo-generators at sub-K temperature is a strong bottleneck for large sub-K experiments, such as large spatial spectro-imagers for astrophysics, or qubits arrays for quantic computing. It is even very often the limitation to the number of channels of the experiments.To tackle this, we have developed a very innovative hybridization technology allowing the interconnections, by a large number of links, of two devices (typically a sub-K detector and the first stage of its readout electronics) cooled at different temperatures (typically 50 mK and 0.3 – 1 K). These hybridizations present a very low electrical resistance and an extremely high thermal resistance, unmatched by existing technologies, thanks to a multilayer superconducting metallization technology.The very low thermal conduction (much lower than the phonon conduction in a homogeneous superconducting material) is obtained thanks to an acoustic mismatch between layers. The link is ultra-compact (≃ μm) and with ultra-low electrical impedance thanks to the use of superconducting materials only. It can be used to interconnect devices, for example when associated with ball hybridization, or inside the elementary cells of low temperature detectors, for example to separate the two functions of absorption and thermometry. So this new process could transform drastically, in the future, the architecture of nearly all sub-K instrumentations.We have already realized such device at the Plateforme Technologique Amont (PTA) Grenoble facility. Measurements in the sub-K range demonstrate very interesting thermal performances. In this paper, we present the principle behind this thermal property of this Multi-Layer, the first results, and the perspectives.
管理高密度信号连接和亚k低温发生器小功率的新方法
低温发生器在亚k温度下的小功率是大型亚k实验的一个强大瓶颈,例如用于天体物理学的大型空间光谱成像仪,或用于量子计算的量子位阵列。它甚至常常是实验通道数量的限制。为了解决这个问题,我们开发了一种非常创新的杂化技术,允许通过大量链接将两个设备(通常是亚K探测器及其读出电子设备的第一级)在不同温度(通常为50 mK和0.3 - 1 K)下冷却。由于多层超导金属化技术,这些杂化表现出非常低的电阻和极高的热阻,这是现有技术无法比拟的。由于层间的声学不匹配,获得了非常低的热传导(远低于均匀超导材料中的声子传导)。由于仅使用超导材料,该连接具有超紧凑(≃μm)和超低电阻抗的特点。它可以用于互连设备,例如当与球杂交相关时,或在低温检测器的基本单元内,例如分离吸收和测温两种功能。所以这个新的过程可能会彻底改变,在未来,几乎所有sub-K仪器的架构。我们已经在格勒诺布尔的plateformetechnologique Amont (PTA)设施实现了这种装置。在亚k范围内的测量显示出非常有趣的热性能。在本文中,我们介绍了这种多层材料的热特性背后的原理,初步结果和前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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