{"title":"Detection of micro-Te segregation at the interface of Cu/Cr phases in Cu-30Cr-0.01Te alloy contact material by XPS","authors":"Jinglin Xie, B. Miao","doi":"10.1109/ICEPE-ST.2011.6122972","DOIUrl":null,"url":null,"abstract":"The composition and bonding energy of Te segregation in Cu-30Cr-0.01Te alloy contact material were investigated by X-ray photoelectron spectroscopy. Photoelectron patterns from the main chemical elements of Cu, Cr and Te on the fresh fracture surface of Cu-30Cr-0.01Te alloy contact material show that Te atoms highly segregated at the interface of Cu/Cr phases, thus the structure and property of the interface between Cu/Cr phases were changed and led to reduce the tensile strength and increase anti-welding property of the contact material.","PeriodicalId":379448,"journal":{"name":"2011 1st International Conference on Electric Power Equipment - Switching Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 1st International Conference on Electric Power Equipment - Switching Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPE-ST.2011.6122972","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The composition and bonding energy of Te segregation in Cu-30Cr-0.01Te alloy contact material were investigated by X-ray photoelectron spectroscopy. Photoelectron patterns from the main chemical elements of Cu, Cr and Te on the fresh fracture surface of Cu-30Cr-0.01Te alloy contact material show that Te atoms highly segregated at the interface of Cu/Cr phases, thus the structure and property of the interface between Cu/Cr phases were changed and led to reduce the tensile strength and increase anti-welding property of the contact material.