A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications

Abstract

FOWLP technology is one of the latest technologies to meet the requirements of small form-factor and high performance for mobile application. In this paper, a new VFO package has been introduced as the next generation platform based on FOWLP technology. This package has unique features of vertical wires on reconstructing stacked dies and multiple RDLs. VFO technology shows a thinner z-height with a stable package warpage, good thermal performance and an enhanced electrical characterization as well as a good reliability. Therefore, it will lead a small form factor and high performance memory application.