H. Kawashima, K. Tanizawa, Keijiro Suzuki, H. Matsuura, S. Suda, C. Guangwei, R. Konoike, S. Namiki, K. Ikeda
{"title":"Silicon Photonic Multiport Optical Switch and Its Control Electronics","authors":"H. Kawashima, K. Tanizawa, Keijiro Suzuki, H. Matsuura, S. Suda, C. Guangwei, R. Konoike, S. Namiki, K. Ikeda","doi":"10.1109/EDTM.2018.8421468","DOIUrl":null,"url":null,"abstract":"Dynamic optical path networks (DOPN) is a good approach for a growing traffic driven by video content. A key component for building DOPN is optical multiport switches. We review recent research progress on our own optical switches integrated by silicon photonics. Clarifying requirements on the switches, we describe preferred switch topologies, mechanism of phase-shifter, fabrication of silicon photonics, packaging techniques including flip-chip bonding, control electronics, steps for testing, and future prospects.","PeriodicalId":418495,"journal":{"name":"2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)","volume":"490 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM.2018.8421468","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Dynamic optical path networks (DOPN) is a good approach for a growing traffic driven by video content. A key component for building DOPN is optical multiport switches. We review recent research progress on our own optical switches integrated by silicon photonics. Clarifying requirements on the switches, we describe preferred switch topologies, mechanism of phase-shifter, fabrication of silicon photonics, packaging techniques including flip-chip bonding, control electronics, steps for testing, and future prospects.